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Intel Xeon E5-2660 v4
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Intel Xeon E5-2660 v4
提了一个问题
google服务框架已停止运行解决方法：　　1、&Downlo
提了一个问题
移动跟电信是运营商 不生产CPU处理器
Intel Xeon E5-2683 v3
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Xeon E5服务器CPU
Intel Xeon E5-2660 v4
Xeon E5服务器CPU
四核心服务器CPU& 产品点评对比
IntelXeon E5-2670 v3和IntelXeon E5-2660 v4和IntelXeon E5-2650 v4点评对比
参数仅为参考，产品以当地实际销售实物为准。至强E5-2600&v4服务器横评综述　　2016年，英特尔在“Tick-Tock”战略发展的步调下，发布新品：至强E5&v4。E5-2600系列处理器从原先的Haswell-EP架构，转换到新的Broadwell-EP架构，在核心数、线程、缓存容量等多方面实现了提升，而之前搭载E5&v3处理器的服务器，随着这次英特尔处理器架构的提升，也迎来了新的技术创新与突破的机会。　　实际上，在统一的x86架构下，无论是国内还是国外厂商，服务器结构难免会呈现趋同的趋势。在这种相似的标准下，不同企业的服务器在细节制造和性能偏重方面依然会有很大的不同。根据ZDC报告显示，搭载至强E5-2600系列处理器的服务器在2016年最受用户关注，基于以上两点，中关村在线企业站针对主流双路至强E5-2600&v4机架服务器进行了横向评测。　　2016年年末，为了深度体验不同企业在相同标准下服务器各方面的不同，笔者向华为、联想、戴尔和杰和四家发出了服务器横评邀请，要求所有参与横评企业提供的服务器要采用统一的至强E5-2600&v4系列处理器，服务器高度为2U，内存32GB以上，配备至少3块硬盘。调查区域：这批英特尔至强E5&v4服务器&你看好谁？(点击预览可查看效果)
提示：支持键盘“← →”键翻页& IntelXeon E5-2660 v4与Xeon E5-2660的区别
IntelXeon E5-2660 v4与IntelXeon E5-2660哪个好
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插槽类型：
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制作工艺：
插槽类型：
Intel Xeon E5-2660
Intel Xeon E5-2660 v4
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提了一个问题
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提了一个问题
移动跟电信是运营商 不生产CPU处理器
Intel Xeon E5-2660
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八核心服务器CPU
Intel Xeon E5-2660 v4
Xeon E5服务器CPU
四核心服务器CPUIntel® Xeon® Processor E5-M Cache, 2.00 GHz) Product Specifications
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Specifications
Product Collection
Vertical Segment
Processor Number
9.6 GT/s QPI
DDR4 33/2400
Scalability
x4, x8, x16
FCLGA2011-3
Max CPU Configuration
Package Size
45mm x 52.5mm
Low Halogen Options Available
Compatible Products
Product Name
Board Form Factor
Chassis Form Factor
Embedded Options Available
SSI EEB 12" x 13"
Rack or Pedestal
SSI EEB 12" x 13"
Rack or Pedestal
SSI EEB 12" x 13"
Rack or Pedestal
SSI EEB 12" x 13"
Rack or Pedestal
Custom 6.4" x 17.7"
Custom 6.4" x 17.7"
Custom 6.4" x 17.7"
Custom 6.8" x 18.9"
Custom 6.8" x 18.9"
Custom 6.8" x 18.9"
Custom 16.7" x 17"
Custom 16.7" x 17"
Custom 16.7" x 17"
Product Name
Board Form Factor
Chassis Form Factor
Embedded Options Available
Custom 6.4" x 17.7"
Custom 6.4" x 17.7"
Custom 6.8" x 18.9"
Custom 6.8" x 18.9"
Custom 6.8" x 18.9"
Custom 6.8" x 18.9"
Custom 6.8" x 18.9"
Custom 6.8" x 18.9"
Product Name
Chassis Form Factor
Board Form Factor
Custom 16.7" x 17"
Custom 16.7" x 17"
Custom 16.7" x 17"
Custom 16.7" x 17"
Product Name
Chassis Form Factor
Board Form Factor
Custom 16.7" x 17"
Custom 16.7" x 17"
Custom 16.7" x 17"
Custom 16.7" x 17"
Custom 16.7" x 17"
Custom 16.7" x 17"
Custom 16.7" x 17"
Benchmarks
SPECfp is a registered trademark of the Standard Performance Evaluation Corporation (SPEC).
SPECint is a registered trademark of the Standard Performance Evaluation Corporation (SPEC).
Software and workloads used in performance tests may have been optimized for performance only on Intel microprocessors.
Performance tests, such as SYSmark and MobileMark, are measured using specific computer systems, components, software, operations and functions. Any change to any of those factors may cause the results to vary. You should consult other information and performance tests to assist you in fully evaluating your contemplated purchases, including the performance of that product when combined with other products. For more complete information visit .
Configurations: System configurations are included in the benchmark details linked above.
Ordering and Compliance
Ordering Code
ECCN5A992C
CCATSG077159
Launch Date
The date the product was first introduced.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Recommended Customer Price
Recommended Customer Price (RCP) is pricing guidance only for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice.
Prices may vary for other package types and shipment quantities. If sold in bulk, price represents individual unit. Listing of RCP does not constitute a formal pricing offer from Intel.
# of Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
# of Threads
A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close.
The processor base frequency is the operating point where TDP is defined.
Frequency is measured in gigahertz (GHz), or billion cycles per second.
Max Turbo Frequency
Max turbo frequency is the maximum single core frequency at which the processor is capable of operating using Intel(R) Turbo Boost Technology. Frequency is measured in gigahertz (GHz), or billion cycles per second.
CPU Cache is an area of fast memory located on the processor.
Intel(R) Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and m direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’ and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
# of QPI Links
QPI (Quick Path Interconnect) links are a high speed, point-to-point interconnect bus between the processor and chipset.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report.
See your Intel representative for details.
Conflict Free
“Conflict free”
means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries.
Memory Types
Intel(R) processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
Max Memory Bandwidth
Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).
Physical Address Extensions
Physical Address Extensions (PAE) is a feature that allows 32-bit processors to access a physical address space larger than 4 gigabytes.
ECC Memory Supported
ECC Memory Supported indicates processor support for Error-Correcting Code memory.
ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Processor Graphics ?
Processor Graphics indicates graphics processing circuitry integrated into the processor, providing the graphics, compute, media, and display capabilities. Intel(R) HD Graphics, Iris(TM) Graphics, Iris Plus Graphics, and Iris Pro Graphics deliver enhanced media conversion, fast frame rates, and 4K Ultra HD (UHD) video. See the
page for more information.
PCI Express Revision
PCI Express Revision is the version supported by the processor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer.
The different PCI Express versions support
different data rates.
PCI Express Configurations ?
PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link the PCH PCIe lanes to PCIe devices.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. # of PCI Express Lanes is the total number supported by the processor.
Sockets Supported
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Case Temperature is the maximum temperature allowed at the processor Integrated Heat Spreader (IHS).
Intel(R) Turbo Boost Technology ?
Intel(R) Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel(R) vPro(TM) Technology ?
Intel(R) vPro(TM) Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security:
1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations.
Intel(R) Hyper-Threading Technology ?
Intel(R) Hyper-Threading Technology (Intel(R) HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner.
Intel(R) Virtualization Technology (VT-x) ?
Intel(R) Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel(R) Virtualization Technology for Directed I/O (VT-d) ?
Intel(R) Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium(R) processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel(R) VT-x with Extended Page Tables (EPT) ?
Intel(R) VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel(R) Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Intel(R) TSX-NI
Intel(R) Transactional Synchronization Extensions New Instructions (Intel(R) TSX-NI) are a set of instructions focused on multi-threaded performance scaling.
This technology helps make parallel operations more efficient via improved control of locks in software.
Intel(R) 64 ?
Intel(R) 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.? Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects.
These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Idle States
Idle States (C-states) are used to save power when the processor is idle.
C0 is the operational state, meaning that the CPU is doing useful work.
C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep(R) Technology
Enhanced Intel SpeedStep(R) Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep(R) Technology switches both voltage and frequency in tandem between high and low levels in response to processor load.
Enhanced Intel SpeedStep(R) Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Intel(R) Demand Based Switching
Intel(R) Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStep(R) Technology in the server marketplace.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features.
An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel(R) Flex Memory Access
Intel(R) Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.
Intel(R) Identity Protection Technology ?
Intel(R) Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel(R) IPT provides a hardware-based proof of a unique user’s PC to websites, financial institutions,
providing verification that it is not malware attempting to login. Intel(R) IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.
Intel(R) AES New Instructions
Intel(R) AES New Instructions (Intel(R) AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Secure Key
Intel(R) Secure Key consists of a digital random number generator that creates truly random numbers to strengthen encryption algorithms.
Intel(R) Trusted Execution Technology ?
Intel(R) Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel(R) processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
Execute Disable Bit ?
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
Pre Active: Orders may be taken, but not scheduled, nor shipped.
Active: This specific part is active.
End of Life: Product End of Life notification has been published.
No Orders after Last Order Entry Date: Used for end of life products. Allows for delivery and returns.
Obsolete: Inventory available. No future supplies will be available.
Retired Price: This specific part is no longer being manufactured or purchased and no inventory is available.
Retired: This specific part is no longer being manufactured or purchased and no inventory is available.
Not Implemented: No Orders, Inquiries, Quotes, Deliveries Returns, or Shipments.
Quality/Reliability Hold.
Reschedule
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice.
The information herein is provided &as-is& and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed.
Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M.
Please contact OEM for the BIOS that includes the latest Processor configuration update.
? This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility.
Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries.
Intel processors manufactured before January 1, 2013 are not confirmed conflict free.
The conflict free designation refers only to product manufactured after that date.
For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.
for more information including details on which processors support Intel(R) HT Technology.
Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel(R) Turbo Boost Technology.
for more information.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products.
Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice.
Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP
does not constitute a formal pricing offer from Intel.
Please work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios.
Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen:
Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product.
Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC
requirements.
The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
For benchmarking data see .
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See
for details.
Processors that support 64-bit computing on Intel(R) architecture require an Intel 64 architecture-enabled BIOS.
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