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LOL全开特效 4500元左右i5-7500配GTX1060电脑配置推荐 (全文)
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DIY市场发展至今，Intel第七代Kaby Lake处理器已经全面上市发售了，目前无论是入门还是中高端处理器深受玩家关注。随着新平台硬件日益普及，对于今后接下来的一年时间里新装机的朋友来说，新平台、新技术、新体验无疑是更好的选择。最近不少网友向小编咨询的配置方案比较多，前面也为大家推荐了不少游戏方面的配置。今天就有一位网友需要组装一台预算4500元左右的游戏主机，主要用来LOL。针对这位网友的需求，小编为其带来了i5-7500配GTX1060电脑配置推荐。LOL全开特效 4500元左右i5-7500配GTX1060电脑配置推荐LOL全开特效 4500元左右i5-7500配GTX1060电脑配置推荐配件名称品牌型号参考价格Intel酷睿i5-7500（散片）￥1159九州风神&玄冰智能￥60影驰GTX1060 6G骁将￥1750华硕B250M-A￥630威刚&8G&2400 DDR4&￥380西数1T&蓝盘￥290金河田G7&￥150台达VX400￥230用户自选&&键鼠装用户自选&&参考价格4679元（2017新七代i5）相关推荐电脑硬件点评：处理器方面，i5 7500处理器是Intel今年面向2017年DIY用户推出的新一代主流四核处理器，主要用于取代上一代i5 6500处理器。从价格可以看出，i5 7500与i5 6500散片价格基本相当，不过在性能、功耗控制、内存支持、核心显卡以及闪充优化方面都有所提升，更为值得今后新装机游戏玩家推荐。i5 7500处理器CPU规格方面，i5-7500原生四核线程，基于新一代Kaby Lake架构，默认主频提升到了3.4Ghz，可以睿频至3.8Ghz，，拥有6M三级缓存，内置最新HD 630核心显卡，支持更高频率的DDR4 2400内存，基于14纳米工艺，拥有更出色的性能体验，加之价格不贵，值得推荐。显卡方面，小编推荐的是知名品牌影驰gtx 1060 骁将独显，该显卡特点如下。影驰GTX1060 骁将属于主流级别的显卡，散热方式为双风扇散热+热管散热；显卡的扩展接口为HDMI接口/DVI接口/DisplayPort接口，PCI Express 3.0 16X ；影驰gtx 1060 骁将显卡的外接电源为6pin ，最大功耗为120W，建议使用电源不低于400W；主板、内存、硬盘点评主板方面，Intel七代CPU上市后，与之对应的200系列新主板也已经上市。与上一代i5-6500最佳搭配B150主板一样，新一代i5 7500最佳搭配的是B250主板。配置中，小编为大家推荐的是华硕B250M-A主板，加入了M.2固态硬盘接口，扩展性更强，一线品牌，主板稳定性与质量有良好的保障。内存方面，七代i5 7500处理器最高可以支持高达DDR4 2400高主频内存，配置中我们推荐的是游戏玩家喜欢的影驰8G&Gaming内存，可以很好的满足各类应用与场景需求，并且后续还可以按需增加内存升级。硬盘方面，鉴于目前SSD涨价的厉害，配置中小编推荐1TB大容量机械硬盘，而没有推荐SSD，后续升级可以考虑加SSD.机箱电源方面都是选用了知名品牌产品。电源方面选用的是台达VX400电源，额定400W，鉴于新一代CPU和GTX1060显卡功耗不是很低，因此400W电源也足以满足整机供电需求。点评：对于DIY来说，选择硬件向来都是买新不买旧，而i5独显平台向来是游戏玩家最热门的装机方案，而这套新平台i5-7500四核独显装机方案完全可以畅玩英雄联盟。
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掌握最新科技资讯，带来最新手机评测，手机技巧和电脑技巧。Intel® Core(TM) i5-7500 Processor (6M Cache, up to 3.80 GHz) Product Specifications
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Specifications
Product Collection
Vertical Segment
Processor Number
$192.00 - $202.00
6 MB SmartCache
8 GT/s DMI3
DDR4-, DDR3L- @ 1.35V
Intel(R) HD Graphics 630
350.00 MHz
Yes, at 60Hz
# of Displays Supported ?
Scalability
Up to 1x16, 2x8, 1x8+2x4
Max CPU Configuration
PCG 2015C (65W)
Package Size
37.5mm x 37.5mm
Low Halogen Options Available
SSE4.1/4.2, AVX 2.0
Compatible Products
Product Name
PCI Express Revision
USB Revision
Embedded Options Available
Recommended Customer Price
8 GT/s DMI3
8 GT/s DMI3
8 GT/s DMI3
8 GT/s DMI3
8 GT/s DMI3
8 GT/s DMI3
8 GT/s DMI3
8 GT/s DMI3
8 GT/s DMI3
8 GT/s DMI3
5 GT/s DMI2
Ordering and Compliance
Ordering Code
Ordering Code
Ordering Code
ECCN5A992C
CCATSG077159
Launch Date
The date the product was first introduced.
Lithography
Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.
Recommended Customer Price
Recommended Customer Price (RCP) is pricing guidance only for Intel products. Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice.
Prices may vary for other package types and shipment quantities. If sold in bulk, price represents individual unit. Listing of RCP does not constitute a formal pricing offer from Intel.
# of Cores
Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).
# of Threads
A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.
Processor Base Frequency
Processor Base Frequency describes the rate at which the processor's transistors open and close.
The processor base frequency is the operating point where TDP is defined.
Frequency is measured in gigahertz (GHz), or billion cycles per second.
Max Turbo Frequency
Max turbo frequency is the maximum single core frequency at which the processor is capable of operating using Intel(R) Turbo Boost Technology. Frequency is measured in gigahertz (GHz), or billion cycles per second.
CPU Cache is an area of fast memory located on the processor.
Intel(R) Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.
A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and m direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’ and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.
# of QPI Links
QPI (Quick Path Interconnect) links are a high speed, point-to-point interconnect bus between the processor and chipset.
Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.
Embedded Options Available
Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report.
See your Intel representative for details.
Conflict Free
“Conflict free”
means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries.
Max Memory Size (dependent on memory type)
Max memory size refers to the maximum memory capacity supported by the processor.
Memory Types
Intel(R) processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.
Max # of Memory Channels
The number of memory channels refers to the bandwidth operation for real world application.
ECC Memory Supported
ECC Memory Supported indicates processor support for Error-Correcting Code memory.
ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.
Processor Graphics ?
Processor Graphics indicates graphics processing circuitry integrated into the processor, providing the graphics, compute, media, and display capabilities. Intel(R) HD Graphics, Iris(TM) Graphics, Iris Plus Graphics, and Iris Pro Graphics deliver enhanced media conversion, fast frame rates, and 4K Ultra HD (UHD) video. See the
page for more information.
Graphics Base Frequency
Graphics Base frequency refers to the rated/guaranteed graphics render clock frequency in MHz.
Graphics Max Dynamic Frequency
Graphics max dynamic frequency refers to the maximum opportunistic graphics render clock frequency (in MHz) that can be supported using Intel(R) HD Graphics with Dynamic Frequency feature.
Graphics Video Max Memory
The maximum amount of memory accessible to processor graphics. Processor graphics operates on the same physical memory as the CPU (subject to OS, driver, and other system limitations).
4K Support
4K support indicates the product's support of 4K resolution, defined here as minimum 3840 x 2160.
Max Resolution (HDMI 1.4)?
Max Resolution (HDMI) is the maximum resolution supported by the processor via the HDMI interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple s actual resolution may be lower on your system.
Max Resolution (DP)?
Max Resolution (DP) is the maximum resolution supported by the processor via the DP interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple s actual resolution may be lower on your system.
Max Resolution (eDP - Integrated Flat Panel)?
Max Resolution (Integrated Flat Panel) is the maximum resolution supported by the processor for a device with an integrated flat panel (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple s actual resolution may be lower on your device.
DirectX* Support
DirectX indicates support for a specific version of Microsoft’s collection of API’s (Application Programming Interfaces) for handling multimedia compute tasks.
OpenGL* Support
OpenGL (Open Graphics Library) is a cross-language, multi-platform API (Application Programming Interface) for rendering 2D and 3D vector graphics.
Intel(R) Quick Sync Video
Intel(R) Quick Sync Video delivers fast conversion of video for portable media players, online sharing, and video editing and authoring.
Intel(R) InTru(TM) 3D Technology
Intel(R) InTru(TM) 3D Technology provides stereoscopic 3-D Blu-ray* playback in full 1080p resolution over HDMI* 1.4 and premium audio.
Intel(R) Clear Video HD Technology
Intel(R) Clear Video HD Technology, like its predecessor, Intel(R) Clear Video Technology, is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture. Intel(R) Clear Video HD Technology adds video quality enhancements for richer color and more realistic skin tones.
Intel(R) Clear Video Technology
Intel(R) Clear Video Technology is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture.
PCI Express Revision
PCI Express Revision is the version supported by the processor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer.
The different PCI Express versions support
different data rates.
PCI Express Configurations ?
PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link the PCH PCIe lanes to PCIe devices.
Max # of PCI Express Lanes
A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. # of PCI Express Lanes is the total number supported by the processor.
Sockets Supported
The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.
Thermal Solution Specification
Intel Reference Heat Sink specification for proper operation of this SKU.
Junction Temperature is the maximum
temperature allowed at the processor die.
Intel(R) Optane(TM) Memory Supported ?
Intel(R) Optane(TM) memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel(R) Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS,
ensuring that data frequently used resides on the fastest tier of storage.
Intel(R) Optane(TM) memory requires specific hardware and software configuration. Visit
for configuration requirements.
Intel(R) Turbo Boost Technology ?
Intel(R) Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel(R) vPro(TM) Technology ?
Intel(R) vPro(TM) Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security:
1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations.
Intel(R) Virtualization Technology (VT-x) ?
Intel(R) Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel(R) Virtualization Technology for Directed I/O (VT-d) ?
Intel(R) Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium(R) processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel(R) VT-x with Extended Page Tables (EPT) ?
Intel(R) VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel(R) Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Intel(R) TSX-NI
Intel(R) Transactional Synchronization Extensions New Instructions (Intel(R) TSX-NI) are a set of instructions focused on multi-threaded performance scaling.
This technology helps make parallel operations more efficient via improved control of locks in software.
Intel(R) 64 ?
Intel(R) 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.? Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Instruction Set
An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Instruction Set Extensions
Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects.
These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Idle States
Idle States (C-states) are used to save power when the processor is idle.
C0 is the operational state, meaning that the CPU is doing useful work.
C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep(R) Technology
Enhanced Intel SpeedStep(R) Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep(R) Technology switches both voltage and frequency in tandem between high and low levels in response to processor load.
Enhanced Intel SpeedStep(R) Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring Technologies
Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features.
An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel(R) Identity Protection Technology ?
Intel(R) Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel(R) IPT provides a hardware-based proof of a unique user’s PC to websites, financial institutions,
providing verification that it is not malware attempting to login. Intel(R) IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.
Intel(R) Stable Image Platform Program (SIPP)
Intel(R) Stable Image Platform Program (Intel(R) SIPP) can help your company identify and deploy standardized, stable image PC platforms for at least 15 months.
Intel(R) AES New Instructions
Intel(R) AES New Instructions (Intel(R) AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.
Secure Key
Intel(R) Secure Key consists of a digital random number generator that creates truly random numbers to strengthen encryption algorithms.
Intel(R) Software Guard Extensions (Intel(R) SGX)
Intel(R) Software Guard Extensions (Intel(R) SGX) provide applications the ability to create hardware enforced trusted execution protection for their applications’ sensitive routines and data. Run-time execution is protected from observation or tampering by any other software (including privileged software) in a system.
Intel(R) Memory Protection Extensions (Intel(R) MPX)
Intel(R) Memory Protection Extensions (Intel(R) MPX) provides a set of hardware features that can be used by software in conjunction with compiler changes to check that memory references intended at compile time do not become unsafe at runtime due to buffer overflow or underflow.
Trusted Execution Technology ?
Intel(R) Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel(R) processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.
Execute Disable Bit ?
Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.
Intel(R) Device Protection Technology with Boot Guard
Intel(R) Device Protection Technology with Boot Guard helps protect the system’s pre-OS environment from viruses and malicious software attacks.
Pre Active: Orders may be taken, but not scheduled, nor shipped.
Active: This specific part is active.
End of Life: Product End of Life notification has been published.
No Orders after Last Order Entry Date: Used for end of life products. Allows for delivery and returns.
Obsolete: Inventory available. No future supplies will be available.
Retired Price: This specific part is no longer being manufactured or purchased and no inventory is available.
Retired: This specific part is no longer being manufactured or purchased and no inventory is available.
Not Implemented: No Orders, Inquiries, Quotes, Deliveries Returns, or Shipments.
Quality/Reliability Hold.
Reschedule
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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice.
The information herein is provided &as-is& and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed.
Please contact system vendor for more information on specific products or systems.
Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M.
Please contact OEM for the BIOS that includes the latest Processor configuration update.
? This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility.
Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin, tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free" in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries.
Intel processors manufactured before January 1, 2013 are not confirmed conflict free.
The conflict free designation refers only to product manufactured after that date.
For Intel Boxed Processors, the conflict free designation refers to the processor only, not to any additional included accessories, such as heatsinks/coolers.
for more information including details on which processors support Intel(R) HT Technology.
Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel(R) Turbo Boost Technology.
for more information.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products.
Prices are for direct Intel customers, typically represent 1,000-unit purchase quantities, and are subject to change without notice.
Taxes and shipping, etc. not included. Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. If sold in bulk, price represents individual unit. Listing of these RCP
does not constitute a formal pricing offer from Intel.
Please work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios.
Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen:
Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product.
Intel components as well as purchased components on the finished assembly meet JS-709 requirements, and the PCB / substrate meet IEC
requirements.
The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
For benchmarking data see .
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See
for details.
Processors that support 64-bit computing on Intel(R) architecture require an Intel 64 architecture-enabled BIOS.
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