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MC52iR3Version: DocId:00.100 MC52iR3_HD_v00.100Hardware Interface Description?MC52iR3 Hardware Interface Description2?Document Name:MC52iR3 Hardware Interface Description00.100
MC52iR3_HD_v00.100 Confidential / Preliminary MC52iR3Version: Date: DocId: Status Supported Products:GENERAL NOTE THE USE OF THE PRODUCT INCLUDING THE SOFTWARE AND DOCUMENTATION (THE &PRODUCT&) IS SUBJECT TO THE RELEASE NOTE PROVIDED TOGETHER WITH PRODUCT. IN ANY EVENT THE PROVISIONS OF THE RELEASE NOTE SHALL PREVAIL. THIS DOCUMENT CONTAINS INFORMATION ON CINTERION PRODUCTS. THE SPECIFICATIONS IN THIS DOCUMENT ARE SUBJECT TO CHANGE AT CINTERION'S DISCRETION. CINTERION WIRELESS MODULES GMBH GRANTS A NON-EXCLUSIVE RIGHT TO USE THE PRODUCT. THE RECIPIENT SHALL NOT TRANSFER, COPY, MODIFY, TRANSLATE, REVERSE ENGINEER, CREATE DERIVATIVE WORKS; DISASSEMBLE OR DECOMPILE THE PRODUCT OR OTHERWISE USE THE PRODUCT EXCEPT AS SPECIFICALLY AUTHORIZED. THE PRODUCT AND THIS DOCUMENT ARE PROVIDED ON AN &AS IS& BASIS ONLY AND MAY CONTAIN DEFICIENCIES OR INADEQUACIES. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, CINTERION WIRELESS MODULES GMBH DISCLAIMS ALL WARRANTIES AND LIABILITIES. THE RECIPIENT UNDERTAKES FOR AN UNLIMITED PERIOD OF TIME TO OBSERVE SECRECY REGARDING ANY INFORMATION AND DATA PROVIDED TO HIM IN THE CONTEXT OF THE DELIVERY OF THE PRODUCT. THIS GENERAL NOTE SHALL BE GOVERNED AND CONSTRUED ACCORDING TO GERMAN LAW. Copyright Transmittal, reproduction, dissemination and/or editing of this document as well as utilization of its contents and communication thereof to others without express authorization are prohibited. Offenders will be held liable for payment of damages. All rights created by patent grant or registration of a utility model or design patent are reserved. Copyright ? 2010, Cinterion Wireless Modules GmbH Trademark Notice Microsoft and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or trademarks mentioned in this document are property of their respective owners.MC52iR3_HD_v00.100 Confidential / PreliminaryPage 2 of 92MC52iR3 Hardware Interface DescriptionContents 92?Contents0 1 Document History ...................................................................................................... 8 Introduction ................................................................................................................. 9 1.1 Related documents ............................................................................................ 9 1.2 Terms and Abbreviations ................................................................................. 10 1.3 Regulatory and Type Approval Information ..................................................... 13 1.3.1 Directives and Standards.................................................................... 13 1.3.2 SAR Requirements Specific to Portable Mobiles................................ 15 1.3.3 Safety Precautions.............................................................................. 16 Product Concept ....................................................................................................... 17 2.1 MC52iR3 Key Features at a Glance ................................................................ 17 2.2 MC52iR3 System Overview ............................................................................. 19 2.3 Circuit Concept ................................................................................................ 20 Application Interface................................................................................................. 21 3.1 Operating Modes ............................................................................................. 22 3.2 Power Supply................................................................................................... 23 3.2.1 Minimizing Power Losses ................................................................... 23 3.2.2 Measuring the Supply Voltage (VBATT+) ............................................... 24 3.2.3 Monitoring Power Supply .................................................................... 24 3.3 Power Up / Power Down Scenarios ................................................................. 25 3.3.1 Turn on MC52iR3................................................................................ 25 3.3.1.1 Switch on MC52iR3 using IGT Signal ................................. 25 3.3.1.2 Turn on MC52iR3 using the RTC (Alarm Mode) ................. 27 3.3.2 Restart MC52iR3 ................................................................................ 28 3.3.2.1 Restart MC52iR3 via AT+CFUN Command ........................ 28 3.3.2.2 Restart MC52iR3 Using EMERG_RST ............................... 28 3.4 Signal States after Startup ............................................................................... 30 3.4.1 Turn off MC52iR3................................................................................ 31 3.4.1.1 Switch off MC52iR3 using AT Command ............................ 31 3.4.2 Automatic Shutdown ........................................................................... 33 3.4.2.1 Thermal Shutdown .............................................................. 33 3.4.2.2 Deferred Shutdown at Extreme Temperature Conditions.... 34 3.4.2.3 Undervoltage Shutdown ...................................................... 34 3.4.2.4 Overvoltage Shutdown ........................................................ 34 3.5 Automatic GPRS Multislot Class Change ........................................................ 35 3.6 Power Saving................................................................................................... 36 3.6.1 No Power Saving (AT+CFUN=1) ........................................................ 36 3.6.2 NON-CYCLIC SLEEP Mode (AT+CFUN=0)....................................... 36 3.6.3 CYCLIC SLEEP Mode (AT+CFUN=7) ................................................ 37 3.6.4 CYCLIC SLEEP Mode AT+CFUN=9 .................................................. 37 3.6.5 Timing of the CTS Signal in CYCLIC SLEEP Modes.......................... 3723MC52iR3_HD_v00.100 Confidential / PreliminaryPage 3 of 92MC52iR3 Hardware Interface DescriptionContents 92?3.7 3.8 3.9 3.10 3.11 3.123.13 3.14 3.15 4Wake up MC52iR3 from SLEEP Mode ............................................... 39 3.6.6.1 Wake-up via RTS0 and RTS1 (if AT+CFUN=0 or AT+CFUN=9)......................................... 40 Summary of State Transitions (except SLEEP Mode) ..................................... 41 RTC Backup..................................................................................................... 42 SIM Interface.................................................................................................... 43 Serial Interface ASC0 ...................................................................................... 44 Serial Interface ASC1 ...................................................................................... 47 Audio interface ................................................................................................. 49 3.12.1 Microphone Circuit .............................................................................. 50 3.12.2 Loudspeaker Output ........................................................................... 51 Digital Audio Interface...................................................................................... 52 Status LED....................................................................................................... 54 Behavior of the RING0 Line (ASC0 Interface only).......................................... 553.6.6Antenna Interface...................................................................................................... 56 4.1 Antenna Installation ......................................................................................... 56 4.1.1 Antenna Pad ....................................................................................... 58 4.1.1.1 Suitable Cable Types .......................................................... 58 4.1.2 Antenna Connector ............................................................................. 59 Electrical, Reliability and Radio Characteristics.................................................... 63 5.1 Absolute Maximum Ratings ............................................................................. 63 5.2 Operating Temperatures.................................................................................. 64 5.3 Storage Conditions .......................................................................................... 65 5.4 Reliability Characteristics ................................................................................. 66 5.5 Electrical Specifications of the Application Interface........................................ 67 5.6 Power Supply Ratings...................................................................................... 72 5.7 Electrical Characteristics of the Voiceband Part .............................................. 73 5.7.1 Setting Audio Parameters by AT Commands ..................................... 73 5.7.2 Audio Programming Model ................................................................. 74 5.7.3 Characteristics of Audio Modes .......................................................... 75 5.7.4 Voiceband Receive Path..................................................................... 76 5.7.5 Voiceband Transmit Path.................................................................... 77 5.8 Air Interface...................................................................................................... 78 5.9 Electrostatic Discharge .................................................................................... 79 Mechanics.................................................................................................................. 80 6.1 Mechanical Dimensions of MC52iR3 ............................................................... 80 6.2 Mounting MC52iR3 onto the Application Platform ........................................... 82 6.3 Board-to-Board Connector............................................................................... 83 6.3.1 Mechanical Dimensions of the Hirose DF12 Connector ..................... 84 Reference Approval .................................................................................................. 85 7.1 Reference Equipment for Type Approval ......................................................... 85567MC52iR3_HD_v00.100 Confidential / PreliminaryPage 4 of 92MC52iR3 Hardware Interface DescriptionContents 92?8 9Sample Application................................................................................................... 86 Appendix.................................................................................................................... 88 9.1 List of Parts and Accessories........................................................................... 88 9.2 Mounting Clip ................................................................................................... 90 9.3 Mounting Advice Sheet .................................................................................... 91MC52iR3_HD_v00.100 Confidential / PreliminaryPage 5 of 92MC52iR3 Hardware Interface DescriptionTables 92?13 13 13 14 14 22 30 33 39 41 43 45 47 52 56 59 60 62 63 64 64 64 65 66 68 72 73 75 76 77 78 79 83 83 88 89 89TablesTable 1: Table 2: Table 3: Table 4: Table 5: Table 6: Table 7: Table 8: Table 9: Table 10: Table 11: Table 12: Table 13: Table 14: Table 15: Table 16: Table 17: Table 18: Table 19: Table 20: Table 21: Table 22: Table 23: Table 24: Table 25: Table 26: Table 27: Table 28: Table 29: Table 30: Table 31: Table 32: Table 33: Table 34: Table 35: Table 36: Table 37: Directives ....................................................................................................... Standards of European type approval............................................................ Requirements of quality ................................................................................. Standards of the Ministry of Information Industry of the People’s Republic of China ............................................................................ Toxic or hazardous substances or elements with defined concentration limits Overview of operating modes ........................................................................ Signal states................................................................................................... Temperature dependent behavior.................................................................. Wake-up events in NON-CYCLIC and CYCLIC SLEEP modes .................... State transitions of MC52iR3 (except SLEEP mode)..................................... Signals of the SIM interface (board-to-board connector) ............................... DCE-DTE wiring of ASC0 .............................................................................. DCE-DTE wiring of ASC1 .............................................................................. Overview of DAI pins...................................................................................... Return loss ..................................................................................................... Product specifications of MC52iR3 antenna connectors................................ Material and finish of MC52iR3 antenna connectors and recommended plugs Ordering information for Hirose U.FL Series.................................................. Absolute maximum ratings............................................................................. Board temperature ......................................................................................... Ambient temperature according to IEC 60068-2 (w/o forced air circulation).. Ambient temperature with forced air circulation (air speed 0.9m/s) ............... Storage conditions ......................................................................................... Summary of reliability test conditions............................................................. Signal description........................................................................................... Power supply ratings...................................................................................... Audio parameters adjustable by AT command .............................................. Voiceband characteristics (typical)................................................................. Voiceband receive path.................................................................................. Voiceband transmit path ................................................................................ Air Interface.................................................................................................... Measured electrostatic values........................................................................ Ordering information DF12 series .................................................................. Electrical and mechanical characteristics of the Hirose DF12C connector.... List of parts and accessories.......................................................................... Molex sales contacts (subject to change) ...................................................... Hirose sales contacts (subject to change) .....................................................MC52iR3_HD_v00.100 Confidential / PreliminaryPage 6 of 92MC52iR3 Hardware Interface DescriptionFigures 92?19 20 24 24 25 26 29 29 32 38 38 42 43 44 46 47 48 49 50 50 51 51 51 52 53 54 55 55 57 57 59 60 60 61 67 74 80 81 83 83 84 85 87FiguresFigure 1: Figure 2: Figure 3: Figure 4: Figure 5: Figure 6: Figure 7: Figure 8: Figure 9: Figure 10: Figure 11: Figure 12: Figure 13: Figure 14: Figure 15: Figure 16: Figure 17: Figure 18: Figure 19: Figure 20: Figure 21: Figure 22: Figure 23: Figure 24: Figure 25: Figure 26: Figure 27: Figure 28: Figure 29: Figure 30: Figure 31: Figure 32: Figure 33: Figure 34: Figure 35: Figure 36: Figure 37: Figure 38: Figure 39: Figure 40: Figure 41: Figure 42: Figure 43: MC52iR3 system overview............................................................................. MC52iR3 block diagram................................................................................. Power supply limits during transmit burst....................................................... Position of the reference test points TP BATT+ and TP GND ....................... IGT circuit sample .......................................................................................... Power-on by ignition signal ............................................................................ Emergency restart timing ............................................................................... EMERG_RST circuit ...................................................................................... Switch off behavior......................................................................................... Timing of CTS signal (example for a 2.12 s paging cycle)............................. Beginning of power saving if CFUN=7 ........................................................... RTC supply variant......................................................................................... External SIM card holder circuit ..................................................................... Serial interface ASC0..................................................................................... ASC0 startup behavior ................................................................................... Serial interface ASC1..................................................................................... ASC1 startup behavior ................................................................................... Audio block diagram....................................................................................... Single ended microphone connection ............................................................ Differential microphone connection................................................................ Line input ....................................................................................................... Differential loudspeaker connection ............................................................... Line output connection ................................................................................... Long frame PCM timing, 256kHz ................................................................... DAI startup timing........................................................................................... Status signalling with LED driver.................................................................... Incoming voice call......................................................................................... URC transmission .......................................................................................... Never use antenna connector and antenna pad at the same time ................ Restricted area around antenna pad.............................................................. Mechanical dimensions of MC52iR3 antenna connectors ............................. U.FL-R-SMT connector with U.FL-LP-040 plug ............................................. U.FL-R-SMT connector with U.FL-LP-066 plug ............................................. Specifications of U.FL-LP-(V)-040(01) plug ................................................... Pin assignment .............................................................................................. Audio programming model ............................................................................. MC52iR3 C top view ....................................................................................... Mechanical dimensions of MC52iR3 (all dimensions in millimeters).............. Hirose DF12C receptacle on MC52iR3.......................................................... Header Hirose DF12 series............................................................................ Mechanical dimensions of Hirose DF12 connector........................................ Reference equipment for approval................................................................. Schematic diagram of MC52iR3 sample application......................................MC52iR3_HD_v00.100 Confidential / PreliminaryPage 7 of 92MC52iR3 Hardware Interface Description0 Document History 8?0Document HistoryNew document: &MC52iR3 Hardware Interface Description& Version 00.100Chapter --What is new Initial document setup.MC52iR3_HD_v00.100 Confidential / PreliminaryPage 8 of 92MC52iR3 Hardware Interface Description1 Introduction 16?1IntroductionThis document1 describes the hardware of the MC52iR3 module that connects to the cellular device application and the air interface. It helps you quickly retrieve interface specifications, electrical and mechanical details and information on the requirements to be considered for integrating further components.1.1[1] [2]Related documentsMC52iR3 AT Command Set MC52iR3 Release NotesPrior to using the MC52iR3 modules or upgrading to a new firmware release, please carefully read the latest product information. For further information visit the Cinterion Wireless Modules Website: http://www.cinterion.com1.The document is effective only if listed in the appropriate Release Notes as part of the technical documentation delivered with your Cinterion Wireless Modules product.MC52iR3_HD_v00.100 Confidential / PreliminaryPage 9 of 92MC52iR3 Hardware Interface Description1.2 Terms and Abbreviations 16?1.2Terms and AbbreviationsDescription Analog-to-Digital Converter Automatic Frequency Control Automatic Gain Control American National Standards Institute Absolute Radio Frequency Channel Number Antenna Reference Point Asynchronous Serial Controller. Abbreviations used for first and second serial interface of MC52iR3 Application Specific Integrated Circuit Thermistor Constant Board-to-board connector Bit Error Rate Base Transceiver Station Cell Broadcast Message Conformité Européene (European Conformity) Challenge Handshake Authentication Protocol Central Processing Unit Coding Scheme Circuit Switched Data Clear to Send Digital-to-Analog Converter Digital Audio Interface Digital level, 3.14dBm0 corresponds to full scale, see ITU G.711, A-law Data Communication Equipment (typically modems, e.g. GSM module) Digital Cellular System, also referred to as PCN Discontinuous Reception Development Support Box Digital Signal Processor Data Set Ready Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM application) Data Terminal Ready Discontinuous Transmission Enhanced Full Rate Enhanced GSMAbbreviation ADC AFC AGC ANSI ARFCN ARP ASC0 / ASC1 ASIC B B2B BER BTS CB or CBM CE CHAP CPU CS CSD CTS DAC DAI dBm0 DCE DCS 1800 DRX DSB DSP DSR DTE DTR DTX EFR EGSMMC52iR3_HD_v00.100 Confidential / PreliminaryPage 10 of 92MC52iR3 Hardware Interface Description1.2 Terms and Abbreviations 16 Abbreviation EMC ESD ETS FDMA FR GMSK GPRS GSM HiZ HR I/O IC IMEI ISO ITU kbps LED Li-Ion Mbps MMI MO MS MSISDN MT MTTF NTC OEM PA PAP PBCCH PCB PCL PCM PCN PDU PLL Description Electromagnetic Compatibility Electrostatic Discharge European Telecommunication Standard Frequency Division Multiple Access Full Rate Gaussian Minimum Shift Keying General Packet Radio Service Global Standard for Mobile Communications High Impedance Half Rate Input/Output Integrated Circuit International Mobile Equipment Identity International Standards Organization International Telecommunications Union kbits per second Light Emitting Diode Lithium-Ion Mbits per second Man Machine Interface Mobile Originated Mobile Station (GSM module), also referred to as TE Mobile Station International ISDN number Mobile Terminated Mean time to failure Negative Temperature Coefficient Original Equipment Manufacturer Power Amplifier Password Authentication Protocol Packet Switched Broadcast Control Channel Printed Circuit Board Power Control Level Pulse Code Modulation?Personal Communications Network, also referred to as DCS 1800 Protocol Data Unit Phase Locked LoopMC52iR3_HD_v00.100 Confidential / PreliminaryPage 11 of 92MC52iR3 Hardware Interface Description1.2 Terms and Abbreviations 16 Abbreviation PPP PSU R&TTE RAM RF RMS ROM RTC Rx SAR SELV SIM SMS SRAM TA TDMA TE Tx UART URC USSD VSWR FD LD MC ME ON RC SM Description Point-to-point protocol Power Supply Unit Radio and Telecommunication Terminal Equipment Random Access Memory Radio Frequency Root Mean Square (value) Read-only Memory Real Time Clock Receive Direction Specific Absorption Rate Safety Extra Low Voltage Subscriber Identification Module Short Message Service Static Random Access Memory Terminal adapter (e.g. GSM module) Time Division Multiple Access Terminal Equipment, also referred to as DTE Transmit Direction Universal asynchronous receiver-transmitter Unsolicited Result Code Unstructured Supplementary Service Data Voltage Standing Wave Ratio SIM fixdialing phonebook?Phonebook abbreviationsSIM last dialling phonebook (list of numbers most recently dialled) Mobile Equipment list of unanswered MT calls (missed calls) Mobile Equipment phonebook Own numbers (MSISDNs) stored on SIM or ME Mobile Equipment list of received calls SIM phonebookMC52iR3_HD_v00.100 Confidential / PreliminaryPage 12 of 92MC52iR3 Hardware Interface Description1.3 Regulatory and Type Approval Information 16?1.3 1.3.1Regulatory and Type Approval Information Directives and StandardsMC52iR3 has been designed to comply with the directives and standards listed below. It is the responsibility of the application manufacturer to ensure compliance of the final product with all provisions of the applicable directives and standards as well as with the technical specifications provided in the &MC52iR3 Hardware Interface Description&.Table 1: Directives99/05/ECDirective of the European Parliament and of the council of 9 March 1999 on radio equipment and telecommunications terminal equipment and the mutual recognition of their conformity (in short referred to as R&TTE Directive 1999/5/EC). The product is labeled with the CE conformity mark Directive of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS)2002/95/ECTable 2: Standards of European type approval3GPP TS 51.010-1 ETSI EN 301 511 V9.0.2Digital cellular telecommunications system (Phase 2); Mobile Station (MS) conformance specification Candidate Harmonized European Standard (Telecommunications series) Global System for Mobile communications (GSM); Harmonized standard for mobile stations in the GSM 900 and DCS 1800 bands covering essential requirements under article 3.2 of the R&TTE directive (1999/5/EC) (GSM 13.11 version 7.0.1 Release 1998) Global Certification Forum - Certification Criteria Candidate Harmonized European Standard (Telecommunications series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Electro Magnetic Compatibility (EMC) standard for radio eq Part 1: Common Technical Requirements Candidate Harmonized European Standard (Telecommunications series) Electro Magnetic Compatibility and Radio spectrum Matters (ERM); Electro Magnetic Compatibility (EMC) standard for radio eq Part 7: Specific conditions for mobile and portable radio and ancillary equipment of digital cellular radio telecommunications systems (GSM and DCS) Safety of information technology equipmentGCF-CC V3.40 ETSI EN 301 489-1 V1.8.1ETSI EN 301 489-7 V1.3.1EN 6Table 3: Requirements of qualityIEC 60068 DIN EN 60529Environmental testing IP codesMC52iR3_HD_v00.100 Confidential / PreliminaryPage 13 of 92MC52iR3 Hardware Interface Description1.3 Regulatory and Type Approval Information 16?Table 4: Standards of the Ministry of Information Industry of the People’s Republic of ChinaSJ/T
SJ/T “Requirements for Concentration Limits for Certain Hazardous Substances in Electronic Information Products” (2006-06). “Marking for Control of Pollution Caused by Electronic Information Products” (2006-06). According to the “Chinese Administration on the Control of Pollution caused by Electronic Information Products” (ACPEIP) the EPUP, i.e., Environmental Protection Use Period, of this product is 20 years as per the symbol shown here, unless otherwise marked. The EPUP is valid only as long as the product is operated within the operating limits described in the Cinterion Wireless Modules Hardware Interface Description. Please see Table 5 for an overview of toxic or hazardous substances or elements that might be contained in product parts in concentrations above the limits defined by SJ/T .Table 5: Toxic or hazardous substances or elements with defined concentration limitsMC52iR3_HD_v00.100 Confidential / PreliminaryPage 14 of 92MC52iR3 Hardware Interface Description1.3 Regulatory and Type Approval Information 16?1.3.2SAR Requirements Specific to Portable MobilesMobile phones, PDAs or other portable transmitters and receivers incorporating a GSM module must be in accordance with the guidelines for human exposure to radio frequency energy. This requires the Specific Absorption Rate (SAR) of portable MC52iR3 based applications to be evaluated and approved for compliance with national and/or international regulations. Since the SAR value varies significantly with the individual product design manufacturers are advised to submit their product for approval if designed for portable use. For European markets the relevant directives are mentioned below. It is the responsibility of the manufacturer of the final product to verify whether or not further standards, recommendations or directives are in force outside these areas. Products intended for sale on European markets EN 50360: Product standard to demonstrate the compliance of mobile phones with the basic restrictions related to human exposure to electromagnetic fields (300MHz - 3GHz)MC52iR3_HD_v00.100 Confidential / PreliminaryPage 15 of 92MC52iR3 Hardware Interface Description1.3 Regulatory and Type Approval Information 16?1.3.3Safety PrecautionsThe following safety precautions must be observed during all phases of the operation, usage, service or repair of any cellular terminal or mobile incorporating MC52iR3. Manufacturers of the cellular terminal are advised to convey the following safety information to users and operating personnel and to incorporate these guidelines into all manuals supplied with the product. Failure to comply with these precautions violates safety standards of design, manufacture and intended use of the product. Cinterion Wireless Modules GmbH assumes no liability for customer failure to comply with these precautions.When in a hospital or other health care facility, observe the restrictions on the use of mobiles. Switch the cellular terminal or mobile off, if instructed to do so by the guidelines posted in sensitive areas. Medical equipment may be sensitive to RF energy. The operation of cardiac pacemakers, other implanted medical equipment and hearing aids can be affected by interference from cellular terminals or mobiles placed close to the device. If in doubt about potential danger, contact the physician or the manufacturer of the device to verify that the equipment is properly shielded. Pacemaker patients are advised to keep their hand-held mobile away from the pacemaker, while it is on. Switch off the cellular terminal or mobile before boarding an aircraft. Make sure it cannot be switched on inadvertently. The operation of wireless appliances in an aircraft is forbidden to prevent interference with communications systems. Failure to observe these instructions may lead to the suspension or denial of cellular services to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the presence of flammable gases or fumes. Switch off the cellular terminal when you are near petrol stations, fuel depots, chemical plants or where blasting operations are in progress. Operation of any electrical equipment in potentially explosive atmospheres can constitute a safety hazard. Your cellular terminal or mobile receives and transmits radio frequency energy while switched on. Remember that interference can occur if it is used close to TV sets, radios, computers or inadequately shielded equipment. Follow any special regulations and always switch off the cellular terminal or mobile wherever forbidden, or when you suspect that it may cause interference or danger. Road safety comes first! Do not use a hand-held cellular terminal or mobile when driving a vehicle, unless it is securely mounted in a holder for handsfree operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Handsfree devices must be installed by qualified personnel. Faulty installation or operation can constitute a safety hazard.SOSIMPORTANT! Cellular terminals or mobiles operate using radio signals and cellular networks. Because of this, connection cannot be guaranteed at all times under all conditions. Therefore, you should never rely solely upon any wireless device for essential communications, for example emergency calls. Remember, in order to make or receive calls, the cellular terminal or mobile must be switched on and in a service area with adequate cellular signal strength. Some networks do not allow for emergency calls if certain network services or phone features are in use (e.g. lock functions, fixed dialling etc.). You may need to deactivate those features before you can make an emergency call. Some networks require that a valid SIM card be properly inserted in the cellular terminal or mobile.MC52iR3_HD_v00.100 Confidential / PreliminaryPage 16 of 92MC52iR3 Hardware Interface Description2 Product Concept 20?22.1Feature GeneralProduct ConceptMC52iR3 Key Features at a GlanceImplementationFrequency bands GSM class Output power (according to Release 99, V5) Power supply Operating temperature (board temperature) Physical RoHS GSM / GPRS features Data transferDual band: GSM 900/1800MHz Small MS Class 4 (+33dBm ±2dB) for EGSM900 Class 1 (+30dBm ±2dB) for GSMV & VBATT+ & 4.8V Normal operation: -30°C to +85°C Restricted operation: -40°C to -30°C and +85°C to +90°C Dimensions: 32.5mm x 35mm x max. 3.1mm Weight: approx. 6g All hardware components fully compliant with EU RoHS DirectiveGPRS: ? Multislot Class 10 ? Full PBCCH support ? Mobile Station Class B ? Coding Scheme 1 C 4 CSD: ? V.110, RLP, non-transparent ? 2.4, 4.8, 9.6, 14.4kbps ? USSD PPP-stack for GPRS data transfer Point-to-point MT and MO Cell broadcast Text and PDU mode Storage: SIM card plus 25 SMS locations in mobile equipment Transmission of SMS alternatively over CSD or GPRS. Preferred mode can be user defined. Group 3; Class 2 Speech codecs: ? Half Rate (ETS 06.20) ? Full Rate (ETS 06.10) ? Enhanced Full Rate (ETS 06.50 / 06.60 / 06.80) ? Adaptive Multi Rate AMR Handsfree operation, echo cancellation, noise reduction, 7 different ringing tones / melodiesSMSFax AudioMC52iR3_HD_v00.100 Confidential / PreliminaryPage 17 of 92MC52iR3 Hardware Interface Description2.1 MC52iR3 Key Features at a Glance 20 Feature Software AT commands SIM Application Toolkit TCP/IP stack Firmware update Interfaces 2 serial interfaces Implementation?Hayes 3GPP TS 27.007, TS 27.005, Cinterion Wireless Modules AT commands for RIL compatibility Supports SAT class 3, GSM 11.14 Release 99, support of letter class “c” Protocols: TCP, UDP, HTTP, FTP, SMTP, POP3 Access by AT commands Windows executable for update over serial interface ASC0 ASC0: ? 8-wire modem interface with status and control lines, unbalanced, asynchronous ? Fixed bit rates: 300bps to 230,000bps ? Autobauding: 1,200bps to 230,000bps ? Supports RTS0/CTS0 hardware handshake and software XON/XOFF flow control. ? Multiplex ability according to GSM 07.10 Multiplexer Protocol. ASC1: ? 4-wire, unbalanced asynchronous interface ? Fixed bit rates: 300bps to 230,000bps ? Supports RTS1/CTS1 hardware handshake and software XON/XOFF flow controlAudio SIM interface1 analog interface 1 digital interface (PCM) Supported SIM cards: 3V, 1.8V External SIM card reader has to be connected via interface connector (note that card reader is not part of MC52iR3) 50?. External antenna can be connected via antenna connector or solderable pad. 50-pin board-to-board connector Switch-on by hardware pin IGT Switch-off by AT command (AT^SMSO) Automatic switch-off in case of critical temperature and voltage conditions Orderly shutdown and reset by AT command Timer functions via AT commands SIM and phone Integrated CTM modem DSB75 Evaluation board designed to test and type approve Cinterion Wireless Module and provide a sample configuration for application engineering. A special adapter is required to connect the module to the DSB75.Antenna Module interface Power on/off, Reset Power on/offReset Special features Real time clock Phonebook TTY/CTM support Evaluation kit DSB75MC52iR3_HD_v00.100 Confidential / PreliminaryPage 18 of 92MC52iR3 Hardware Interface Description2.2 MC52iR3 System Overview 20?2.2MC52iR3 System OverviewModule4ApplicationDAI Digital audio (PCM)1STATUSSTATUSMicrophone feedingBoard-to-board connector21AUDIO21AudioASC0 ASC1 SIM interfaceSerial modem interface Serial interface SIM card648CONTROLIGT Emergency reset Backup supply Power supplyRTC5POWER5111ANTENNAAntenna2Figure 1: MC52iR3 system overviewMC52iR3_HD_v00.100 Confidential / PreliminaryPage 19 of 92MC52iR3 Hardware Interface Description2.3 Circuit Concept 20?2.3Circuit ConceptFigure 2 shows a block diagram of the MC52iR3 module and illustrates the major functional components: The baseband consists of the following parts: ? GSM baseband processor and power management ? Stacked flash / SRAM memory ? Application interface (50-pin board-to-board connector) GSM RF block: ? RF transceiver (part of baseband connector) ? RF power amplifier / front-end module inc. harmonics filtering ? Receive SAW filtersRF power amplifier/ Frontend moduleAntenna InterfaceControlRX SAW filterRX SAW filterPOWERStatus Board-to-board connector DAI AudioTransceiverSwitching regulatorRF-Linear regulatorBB-Linear regulatorSerial modem interface26MHzGSM processor and power managementMeasurement RTC Data&Address bus Memory interfaceDAI Audio Serial interface SIM Serial interface IGT Emergency Reset RTC supplyControlADC SIM interface32kHzFlash/PSRAMFigure 2: MC52iR3 block diagramMC52iR3_HD_v00.100 Confidential / PreliminaryPage 20 of 92MC52iR3 Hardware Interface Description3 Application Interface 55?3Application InterfaceMC52iR3 is equipped with a 50-pin board-to-board connector that connects to the external application. The host interface incorporates several sub-interfaces described in the following sections: ? Power supply - see Section 3.2 ? RTC backup - see Section 3.8 ? SIM interface - see Section 3.9 ? Serial interface ASC0 - see Section 3.10 ? Serial interface ASC1 - see Section 3.11 ? Analog audio interface - see Section 3.12 ? Digital audio interface (PCM) - see Section 3.13 ? Status LED - see Section 3.14 Electrical and mechanical characteristics of the board-to-board connector are specified in Section 6.3. Ordering information for mating connectors and cables are included.MC52iR3_HD_v00.100 Confidential / PreliminaryPage 21 of 92MC52iR3 Hardware Interface Description3.1 Operating Modes 55?3.1Operating ModesThe table below briefly summarizes the various operating modes referred to in the following sections.Table 6: Overview of operating modesMode Normal operationFunction GSM / GPRS SLEEP Various powersave modes set with AT+CFUN command. Software is active to minimum extent. If the module was registered to the GSM network in IDLE mode, it is registered and paging with the BTS in SLEEP mode, too. Power saving can be chosen at different levels: The NON-CYCLIC SLEEP mode (AT+CFUN=0) disables the AT interface. The CYCLIC SLEEP modes AT+CFUN= 7 and 9 alternatingly activate and deactivate the AT interfaces to allow permanent access to all AT commands. Software is active. Once registered to the GSM network, paging with BTS is carried out. The module is ready to send and receive. Connection between two subscribers is in progress. Power consumption depends on network coverage individual settings, such as DTX off/on, FR/EFR/HR, hopping sequences, antenna. Module is ready for GPRS data transfer, but no data is currently sent or received. Power consumption depends on network settings and GPRS configuration (e.g. multislot settings). GPRS data transfer in progress. Power consumption depends on network settings (e.g. power control level), uplink / downlink data rates and GPRS configuration (e.g. used multislot settings).GSM IDLEGSM TALKGPRS IDLEGPRS DATAPower DownNormal shutdown after sending the AT^SMSO command. Only a voltage regulator is active for powering the RTC. Software is not active. Interfaces are not accessible. Operating voltage (connected to BATT+) remains applied. Restricted operation launched by RTC alert function while the module is in Power Down mode. Module will not be registered to GSM network. Limited number of AT commands is accessible.Alarm modeSee the following sections for the various options of waking up MC52iR3 and proceeding from one mode to another.MC52iR3_HD_v00.100 Confidential / PreliminaryPage 22 of 92MC52iR3 Hardware Interface Description3.2 Power Supply 55?3.2Power SupplyMC52iR3 needs to be connected to a power supply at the board-to-board connector (5 pins each BATT+ and GND). The power supply of MC52iR3 has to be a single voltage source at BATT+. It must be able to provide the peak current during the uplink transmission. All the key functions for supplying power to the device are handled by an ASIC power supply. The ASIC provides the following features: ? Stabilizes the supply voltages for the GSM baseband using low drop linear voltage regulators. ? Switches the module's power voltages for the power-up and -down procedures. ? Delivers, across the VDD pin, a regulated voltage for an external application. This voltage is not available in Power-down mode. ? SIM switch to provide SIM power supply.3.2.1Minimizing Power LossesWhen designing the power supply for your application please pay specific attention to power losses. Ensure that the input voltage VBATT+ never drops below 3.3V on the MC52iR3 board, not even in a transmit burst where current consumption can rise (for peak values see the power supply ratings listed in Section 5.6). It should be noted that MC52iR3 switches off when exceeding these limits. Any voltage drops that may occur in a transmit burst should not exceed 400mV. The module switches off if the minimum supply voltage (VBattMin) is reached. Example:VBattLowLimit = 3.3V VDropMax = 0.4V VBattMin = VBattLowLimit + VDropMax VBattMin = 3.3V + 0.4V = 3.7VThe best approach to reducing voltage drops is to use a board-to-board connection as recommended, and a low impedance power source. The resistance of the power supply lines on the host board and of a battery pack should also be considered. Note: If the application design requires an adapter cable between both board-to-board connectors, use a cable as short as possible in order to minimize power losses.MC52iR3_HD_v00.100 Confidential / PreliminaryPage 23 of 92MC52iR3 Hardware Interface Description3.2 Power Supply 55?If the length of the cable reaches the maximum length of 100mm, this connection may cause, for example, a resistance of 30m? in the BATT+ line and 30m? in the GND line. As a result, a 1.6A transmit burst would add up to a total voltage drop of 96mV. Plus, if a battery pack is involved, further losses may occur due to the resistance across the battery lines and the internal resistance of the battery including its protective circuit.Figure 3: Power supply limits during transmit burst3.2.2Measuring the Supply Voltage (VBATT+)Figure 4 shows reference test points for measuring the supply voltage VBATT+ on the module: TP BATT+ and TP GND. The test point for BATT+ is located above the board-to-board connector of the module. The test point for GND can be the module shielding. TP BATT+TP GNDFigure 4: Position of the reference test points TP BATT+ and TP GND3.2.3Monitoring Power SupplyTo help you monitor the supply voltage you can use the AT^SBV command which returns the voltage related to the test points TP BATT+ and TP GND. The voltage is continuously measured at intervals depending on the operating mode on the RF interface. The duration of measuring ranges from 0.5s in TALK/DATA mode up to 50s when MC52iR3 is in IDLE mode or Limited Service (deregistered). The displayed voltage (in mV) is averaged over the last measuring period before the AT^SBV command was executed.MC52iR3_HD_v00.100 Confidential / PreliminaryPage 24 of 92MC52iR3 Hardware Interface Description3.3 Power Up / Power Down Scenarios 55?3.3Power Up / Power Down ScenariosIn general, be sure not to turn on MC52iR3 while it is out of the operating range of voltage and temperature stated in Section 5.2 and Section 5.6. MC52iR3 would immediately switch off after having started and detected these inappropriate conditions. In extreme cases this can cause permanent damage to the module.3.3.1Turn on MC52iR3MC52iR3 can be started as described in the following sections: ? Hardware driven switch on by IGT line: Starts Normal mode (see Section 3.3.1.1 and Section ). ? Wake-up from Power Down mode by using RTC interrupt: Starts Alarm mode (see Section 3.3.1.2).3.3.1.1Switch on MC52iR3 using IGT SignalWhen the operating voltage BATT+ is applied, MC52iR3 can be switched on by means of the IGT signal. If the operating voltage BATT+ is applied while the IGT signal is present, MC52iR3 will be switched on automatically. Please note that if the rise time for the operating voltage BATT+ is longer than 12ms, the module startup will be delayed by about 1 second. Please also note that if there is no IGT signal present right after applying BATT+, MC52iR3 will instead of switching on perform a very short switch on/off sequence (approx. 120ms) that cannot be avoided. The IGT signal is a low active signal and only allows the input voltage level of the VDDLP signal. The following Figure 5 shows an example for a switch-on circuit.IGT100kSignal to start up the moduleFigure 5: IGT circuit sampleMC52iR3_HD_v00.100 Confidential / PreliminaryPage 25 of 92MC52iR3 Hardware Interface Description3.3 Power Up / Power Down Scenarios 55?Please also note that if the state of the IGT signal is coupled to the state of the VDDLP line or that if the IGT signal otherwise remains active low after switch on, it is no longer possible to switch off MC52iR3 using the AT command AT^SMSO. Using this command will instead automatically restart the module.Module start up BATT+ VDDLP IGT Internal reset VDD EMERG_RST & 10ms app. 30msFigure 6: Power-on by ignition signalIf configured to a fixed bit rate (AT+IPR?0), the module will send the URC &^SYSSTART& which notifies the host application that the first AT command can be sent to the module. The duration until this URC is output varies with the SIM card and may take a couple of seconds, particularly if the request for the SIM PIN is deactivated on the SIM card. Please note that no &^SYSSTART& URC will be generated if autobauding (AT+IPR=0) is enabled. To allow the application to detect the ready state of the module we recommend using hardware flow control which can be set with AT\Q (see [1] for details). The default setting is AT\Q0 (no flow control) which shall be altered to AT\Q3 (RTS/CTS handshake). If the application design does not integrate RTS/CTS lines the host application shall wait at least for the &^SYSSTART& URC. However, if the URC is not available (due to autobauding), you will simply have to wait for a period of time (at least 2 seconds) before assuming the module to be in ready state and before entering any data. Please note that no data must be sent over the ASC0 interface before the interface is active and ready to receive data.MC52iR3_HD_v00.100 Confidential / PreliminaryPage 26 of 92MC52iR3 Hardware Interface Description3.3 Power Up / Power Down Scenarios 55?3.3.1.2Turn on MC52iR3 using the RTC (Alarm Mode)Another power-on approach is to use the RTC, which is constantly supplied with power from a separate voltage regulator in the power supply ASIC. The RTC provides an alert function, which allows the MC52iR3 to wake up whilst the internal voltage regulators are off. To prevent the module from unintentionally logging into the GSM network, this procedure only enables restricted operation, referred to as Alarm mode. It must not be confused with a wake-up or alarm call that can be activated by using the same AT command, but without switching off power. Use the AT+CALA command to set the alarm time. The RTC retains the alarm time if MC52iR3 was powered down by AT^SMSO. Once the alarm is timed out and executed, MC52iR3 enters the Alarm mode. This is indicated by an Unsolicited Result Code (URC) which reads: ^SYSSTART ALARM MODE Note that this URC is the only indication of the Alarm mode and will not appear when autobauding was activated (due to the missing synchronization between DTE and DCE upon start-up). Therefore, it is recommended to select a fixed baudrate before using the Alarm mode. In Alarm mode the module is deregistered from the GSM network and only a limited number of AT commands is available. For a table showing the availability of AT commands depending on the module‘s operating mode please refer to [1]. For the module to change from Alarm mode to full operation (normal operating mode) it is possible to use the AT+CFUN command or to drive the ignition line to ground. The latter must be implemented in your host application as described in Section 3.3.1.1. If your host application uses the STATUS pin to control a status LED as described in Section 3.14, please note that the LED is off while the GSM module is in Alarm mode.MC52iR3_HD_v00.100 Confidential / PreliminaryPage 27 of 92MC52iR3 Hardware Interface Description3.3 Power Up / Power Down Scenarios 55?3.3.2Restart MC52iR3After startup MC52iR3 can be re-started as described in the following sections: ? Software controlled reset by AT+CFUN command: Starts Normal mode (see Section 3.3.2.1). ? Hardware controlled reset by EMERG_RST line: Starts Normal mode (see Section 3.3.2.2)3.3.2.1Restart MC52iR3 via AT+CFUN CommandTo reset and restart the MC52iR3 module use the command AT+CFUN. You can enter the command AT+CFUN=,1 or 1,1 or 7,1 or 9,1. See [1] for details. If configured to a fix baud rate (AT+IPR?0), the module will send the URC &^SYSSTART& to notify that it is ready to operate. If autobauding is enabled (AT+IPR=0) there will be no notification. To register to the network SIM PIN authentication is necessary after restart.3.3.2.2Restart MC52iR3 Using EMERG_RSTThe EMERG_RST signal is internally connected to the central GSM processor. A low level for more than 10ms sets the processor and with it all the other signal pads to their respective reset state. The reset state is mentioned in Section 3.4 as well as in the figures showing the startup behavior of the serial interfaces. After releasing the EMERG-RST line, i.e., with a change of the signal level from low to high, the module restarts. The other signals continue from their reset state as if the module was switched on by the ON signal (see Figure 7).MC52iR3_HD_v00.100 Confidential / PreliminaryPage 28 of 92MC52iR3 Hardware Interface Description3.3 Power Up / Power Down Scenarios 55?Reset State Firmware initializationSystem started BATT+ VDDLP IGT VDD EMERG_RST Internally Reset&10msSystem started againFigure 7: Emergency restart timingIt is recommended to control this EMERG_RST line with an open collector transistor or an open drain field-effect transistor. The following figure shows a sample for such a control circuit.EMERG_RST100kSignal to restart the moduleFigure 8: EMERG_RST circuitCaution: Use the EMERG_RST line only when, due to serious problems, the software is not responding for more than 5 seconds. Pulling the EMERG_RST line causes the loss of all information stored in the volatile memory. Therefore, this procedure is intended only for use in case of emergency, e.g. if MC52iR3 does not respond, if reset or shutdown via AT command fails.MC52iR3_HD_v00.100 Confidential / PreliminaryPage 29 of 92MC52iR3 Hardware Interface Description3.4 Signal States after Startup 55?3.4Signal States after StartupTable 7 lists states the interface signals pass through during reset and firmware initialization. The reset state is reached with the rising edge of the EMERG_RST signal - either after a normal module startup (see Section 3.3.1) or after a reset (see Section 3.3.2). After the reset state has been reached the firmware initialization state begins. The firmware initialization is completed as soon as the ASC0 interface lines CTS0, DSR0 and RING0 as well as the ASC1 interface line CTS1 have turned low (see Section 3.10 and Section 3.11). Now, the module is ready to receive and transmit data.Table 7: Signal statesSignal name CCIN CCRST CCIO CCCLK RXD0 TXD0 CTS0 RTS0 RING0 DTR0 DCD0 DSR0 RXD1 TXD1 CTS1 RTS1 RXDDAI SCLK TFSDAI TXDDAI RFSDAI STATUSReset state T / 100k PD L L L T / 2 x PU_A T / 2 x PU_A PD_B T / 10k PU T / 10k PU T / 10k PU T / 10k PU T / 5k PU T / 10k PU T / 2.2k PU T / 10k PU T / 10k PU T / PD_B T / PU_B T / PD_B T / PD_B 10k PD T / 10k PUFirmware initialization I / 100k PD O/L O/L O/L O/H I O/H I / 10k PU O / H, 10k PU I / 10k PU O / H, 10k PU O / H, 5k PU O / H, 10k PU I / 2.2k PU O / H, 10k PU I / 10k PU I / PD_B O/H O/L O/L 10k PD O / H, 10k PUAbbreviations used in above Table 7:L = Low level H = High level L/H = Low or high level T = Tristate I = Input O = Output OD = Open Drain PD_A = Pull down, 103?A at 1.75V PD_B = Pull down, 51?A at 1.75V PD_C = Pull down, 27?A at 1.75V PU_A = Pull up -102?A at 0.05V PU_B = Pull up -55?A at 0.05V PU_C = Pull up -31?A at 0.05VMC52iR3_HD_v00.100 Confidential / PreliminaryPage 30 of 92MC52iR3 Hardware Interface Description3.4 Signal States after Startup 55?3.4.1Turn off MC52iR3To switch the module off the following procedures may be used: ? Normal shutdown procedure: Software controlled by sending the AT^SMSO command over the serial application interface. See Section 3.4.1.1. ? Automatic shutdown: See Section 3.4.2 - Takes effect if under- or overvoltage is detected. - Takes effect if MC52iR3 board temperature exceeds a critical limit.3.4.1.1Switch off MC52iR3 using AT CommandThe best and safest approach to powering down MC52iR3 is to issue the AT^SMSO command. This procedure lets MC52iR3 log off from the network and allows the software to enter into a secure state and safe data before disconnecting the power supply. The mode is referred to as Power Down mode. In this mode, only the RTC stays active. Before switching off the device sends the following response: ^SMSO: MS OFF OK ^SHUTDOWN After sending AT^SMSO do not enter any other AT commands. There are two ways to verify when the module turns off: ? Wait for the URC “^SHUTDOWN”. It indicates that data have been stored non-volatile and the module turns off in less than 1 second. ? Also, you can monitor the VDD pin. The low state of VDD definitely indicates that the module is switched off. Be sure not to disconnect the operating voltage VBATT+ before the URC “^SHUTDOWN” has been issued and the VDD signal has gone low. Otherwise you run the risk of losing data. While MC52iR3 is in Power Down mode the application interface is switched off and must not be fed from any other source. Therefore, your application must be designed to avoid any current flow into any digital pins of the application interface.MC52iR3_HD_v00.100 Confidential / PreliminaryPage 31 of 92MC52iR3 Hardware Interface Description3.4 Signal States after Startup 55?Power downAT^SMSO System power down procedureBATT+ VDDLP IGT VDD EMERG_RSTFigure 9: Switch off behaviorMC52iR3_HD_v00.100 Confidential / PreliminaryPage 32 of 92MC52iR3 Hardware Interface Description3.4 Signal States after Startup 55?3.4.2Automatic ShutdownAutomatic shutdown takes effect if ? the MC52iR3 board exceeds the critical limits of overtemperature or undertemperature ? Undervoltage or overvoltage is detected The automatic shutdown procedure is equivalent to the power-down initiated with the AT^SMSO command, i.e. MC52iR3 logs off from the network and the software enters a secure state avoiding loss of data.3.4.2.1Thermal ShutdownThe board temperature is constantly monitored by an internal NTC resistor located on the PCB. The values detected by either NTC resistor are measured directly on the board or the battery and therefore, are not fully identical with the ambient temperature. Each time the board temperature goes out of range or back to normal, MC52iR3 instantly displays an alert (if enabled). ? URCs indicating the level &1& or &-1& allow the user to take appropriate precautions, such as protecting the module from exposure to extreme conditions. The presentation of the URCs depends on the settings selected with the AT^SCTM write command (for details see [1]): AT^SCTM=1: Presentation of URCs is always enabled. AT^SCTM=0 (default): Presentation of URCs is enabled during the 2 minute guard period after start-up of MC52iR3. After expiry of the 2 minute guard period, the presentation will be disabled, i.e. no URCs with alert levels &1& or ''-1& will be generated. ? URCs indicating the level &2& or &-2& are instantly followed by an orderly shutdown, except in cases described in Section 3.4.2.2. The presentation of these URCs is always enabled, i.e. they will be output even though the factory setting AT^SCTM=0 was never changed. The maximum temperature ratings are stated in Section 5.2. Refer to Table 8 for the associated URCs.Table 8: Temperature dependent behaviorSending temperature alert (2min after start-up, otherwise only if URC presentation enabled) ^SCTM_B: 1 ^SCTM_B: -1 ^SCTM_B: 0 ^SCTM_B: 2 ^SCTM_B: -2 Board close to overtemperature limit. Board close to undertemperature limit. Board back to non-critical temperature range. Alert: Board equal or beyond overtemperature limit. MC52iR3 switches off. Alert: Board equal or below undertemperature limit. MC52iR3 switches off.Automatic shutdown (URC appears no matter whether or not presentation was enabled)MC52iR3_HD_v00.100 Confidential / PreliminaryPage 33 of 92MC52iR3 Hardware Interface Description3.4 Signal States after Startup 55?3.4.2.2Deferred Shutdown at Extreme Temperature ConditionsIn the following cases, automatic shutdown will be deferred if a critical temperature limit is exceeded: ? While an emergency call is in progress. ? During a two minute guard period after power-up. This guard period has been introduced in order to allow for the user to make an emergency call. The start of any one of these calls extends the guard period until the end of the call. Any other network activity may be terminated by shutdown upon expiry of the guard time. While in a &deferred shutdown& situation, MC52iR3 continues to measure the temperature and to deliver alert messages, but deactivates the shutdown functionality. Once the 2 minute guard period is expired or the call is terminated, full temperature control will be resumed. If the temperature is still out of range, MC52iR3 switches off immediately (without another alert message). CAUTION! Automatic shutdown is a safety feature intended to prevent damage to the module. Extended usage of the deferred shutdown facilities provided may result in damage to the module, and possibly other severe consequences.3.4.2.3Undervoltage ShutdownThe undervoltage threshold is 100mV below the minimum supply voltage VBATT+ specified in Table 26. When the supply voltage approaches the undervoltage shutdown threshold the module will send the following URC: ^SBC: Undervoltage. This alert is sent once. When the overvoltage shutdown threshold is exceeded the module will shut down cleanly. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur.3.4.2.4Overvoltage ShutdownThe overvoltage shutdown threshold is 100mV above the maximum supply voltage VBATT+ specified in Table 26. When the supply voltage approaches the overvoltage shutdown threshold the module will send the following URC: ^SBC: Overvoltage. This alert is sent once. When the overvoltage shutdown threshold is exceeded the module will shut down cleanly. This type of URC does not need to be activated by the user. It will be output automatically when fault conditions occur. Keep in mind that several MC52iR3 components are directly linked to BATT+ and, therefore, the supply voltage remains applied at major parts of MC52iR3. Especially the power amplifier is very sensitive to high voltage and might even be destroyed.MC52iR3_HD_v00.100 Confidential / PreliminaryPage 34 of 92MC52iR3 Hardware Interface Description3.5 Automatic GPRS Multislot Class Change 55?3.5Automatic GPRS Multislot Class ChangeTemperature control is also effective for operation in GPRS Multislot Class 10. If the board temperature increases to the limit specified for restricted operation (see Section 5.2 for temperature limits) while data is transmitted over GPRS, the module automatically reverts from GPRS Multislot Class 10 (2Tx) to Class 8 (1Tx). This reduces the power consumption and, consequently, causes the board’s temperature to decrease. Once the temperature drops to a value of 5 degrees below the limit of restricted operation, MC52iR3 returns to the higher Multislot Class. If the temperature stays at the critical level or even continues to rise, MC52iR3 will not switch back to the higher class. After a transition from Multislot Class 10 to Multislot 8 a possible switchback to Multislot Class 10 is blocked for one minute. Please note that there is not one single cause of switching over to a lower GPRS Multislot Class. Rather it is the result of an interaction of several factors, such as the board temperature that depends largely on the ambient temperature, the operating mode and the transmit power. Furthermore, take into account that there is a delay until the network proceeds to a lower or, accordingly, higher Multislot Class. The delay time is network dependent. In extreme cases, if it takes too much time for the network and the temperature cannot drop due to this delay, the module may even switch off as described in Section 3.4.2.1.MC52iR3_HD_v00.100 Confidential / PreliminaryPage 35 of 92MC52iR3 Hardware Interface Description3.6 Power Saving 55?3.6Power SavingSLEEP mode reduces the functionality of the MC52iR3 module to a minimum and, thus, minimizes the current consumption to the lowest level. Settings can be made using the AT+CFUN command. For details see below and [1]. SLEEP mode falls into two categories: ? NON-CYCLIC SLEEP mode AT+CFUN=0 ? CYCLIC SLEEP modes, selectable with AT+CFUN=7 or 9. IMPORTANT: Please keep in mind that power saving works properly only when PIN authentication has been done. If you attempt to activate power saving while the SIM card is not inserted or the PIN not correctly entered (Limited Service), the selected &fun& level will be set, though power saving does not take effect. For the same reason, power saving cannot be used if MC52iR3 operates in Alarm mode. To check whether power saving is on, you can query the status of AT+CFUN if you have chosen CYCLIC SLEEP mode. The wake-up procedures are quite different depending on the selected SLEEP mode. Table 9 compares the wake-up events that can occur in NON-CYCLIC and CYCLIC SLEEP modes.3.6.1No Power Saving (AT+CFUN=1)The functionality level &fun&=1 is where power saving is switched off. This is the default after startup.3.6.2NON-CYCLIC SLEEP Mode (AT+CFUN=0)If level 0 has been selected (AT+CFUN=0), the serial interface is blocked. The module shortly deactivates power saving to listen to a paging message sent from the base station and then immediately resumes power saving. Level 0 is called NON-CYCLIC SLEEP mode, since the serial interface is not alternatingly made accessible as in CYCLIC SLEEP mode. The first wake-up event fully activates the module, enables the serial interface and terminates the power saving mode. In short, it takes MC52iR3 back to the highest level of functionality &fun&=1. In NON-CYCLIC mode, the falling edge of the RTS0 or RTS1 lines wakes up the module to &fun&=1. To efficiently use this feature it is recommended to enable hardware flow control (RTS/CTS handshake) as in this case the CTS line notifies the application when the module is ready to send or receive characters. See Section 3.6.6.1 for details.MC52iR3_HD_v00.100 Confidential / PreliminaryPage 36 of 92MC52iR3 Hardware Interface Description3.6 Power Saving 55?3.6.3CYCLIC SLEEP Mode (AT+CFUN=7)The functionality level AT+CFUN=7 is referred to as CYCLIC SLEEP mode. The major benefit of all CYCLIC SLEEP modes is that the serial interface remains accessible, and that, in intermittent wake-up periods, characters c